Vision Features for
Ceramic Green Tape, Substrate and FPC Inspection
critical factors are involved in the inspection of Green Tape, and
hybrid substrates as compared to more standardized industrial
inspections. Through years of industry experience, SIBCO has identified
and incorporated the following features into our MIDAS Vision software
for the benefit of our users.
inspection to verify presence, location, and formation of thousands of
vias in each layer. This capability allows monitoring of the punch
process as well as via fill steps to ensure proper operation.
Conductive Line Defect Detection
detection and reporting of all opens, shorts, voids, excesses, and
contamination of printed patterns is provided. An unlimited number of
tolerance windows can be set to maximize throughput and minimize
potential "false calls".
verification in both global and local modes is conducted on each
inspection operation to ensure that tolerances are not exceeded. Local
registration is especially useful in detecting and predicting
production issues such as screen and sheet stretch. Translation of x,
y, and theta inspection data is generated in order to adjust process
set up parameters.
No in depth
computer knowledge is needed to operate a MIDAS Vision system.
Templates are automatically converted from CAD designs. Defect
detection tolerances are set by per feature and can be customized by
the operator. Set up and learn time (prior to inspection) for a typical
circuit is under 15 minutes for a trained operator.
Part Template Switching
data files reside in memory in the Vision Processor for instant access
in situations where multiple layers or different part configurations
must be inspected rapidly.
weight calculations are available via pixel count windows encompassing
the entire part or selected windows. Resistor pattern area
coverage can be measured and defined in targeting operations.
Windows Option allows full measurement commands for windows placed
throughout the vision scan area. Measurements locate part features.
Part Marker can be interfaced to the System to allow automatic
identification of "bad" circuits on a multi-up substrate. The marker
may be integrated directly into the MIDAS hardware, or (for in-line
applications) may require additional hardware.
Process Control (SPC) Data
defect data files are currently saved to disk for later retrieval and
input to a customer driven SPC database. Defect files are stored in
ASCII format and are easily ported to customer applications. SPC is an
essential part of any closed loop control production cycle.